Increasing the reliability of DFB lasers on glass: the approach of encapsulation by wafer bonding-Reference-Cited by-同舟云学术

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Increasing the reliability of DFB lasers on glass: the approach of encapsulation by wafer bonding

Published:2022-03-05 Issue: Volume: Page:
ISSN:
Container-title:Integrated Optics: Devices, Materials, and Technologies XXVI
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Author:

Hetier Léo,Bastard Lionel,Broquin Jean-Emmanuel,Poëtte Julien

Publisher

SPIE

Reference15 articles.

1. The airborne multi-wavelength water vapor differential absorption lidar WALES: system design and performance

2. Tunable, continuous-wave Terahertz photomixer sources and applications

3. Fiber-bragg-grating external cavity semiconductor laser (fgl) module for dwdm transmission

4. Instrumentation for the stable operation of laser diodes

5. Relation Between Frequency and Intensity Stabilities in AlGaAs Semiconductor Laser

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. THz generation by beating of self-running Er-based ion-exchanged DFB lasers co-integrated on one single chip;Integrated Optics: Devices, Materials, and Technologies XXVII;2023-03-17

2. Multiple co-integrated glass lasing structures for THz generation;2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz);2022-08-28

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