Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress
Author:
Affiliation:
1. Chinese Academy of Sciences, Xi’an Institute of Optics and Precision Mechanics, State Key Laboratory
2. Focuslight Technologies Inc., Xi’an, Shaanxi
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics
Reference18 articles.
1. Dependence on intrinsic strain of packaging-induced strain in quantum-well laser diodes;Biermann,2004
2. Imaging of stresses in GaAs diode lasers using polarization-resolved photoluminescence
3. Microphotoluminescence mapping of packaging-induced stress distribution in high-power AlGaAs laser diodes
4. Strain mapping by measurement of the degree of polarization of photoluminescence
5. Easy method to measure the packaging-induced stress of a semiconductor laser diode by lasing wavelength shifting
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1. Spectral analysis of beam-combining-systems based on laser array with smile effect;Optics Communications;2024-01
2. Method to reduce the smile of high-power diode laser bar by balancing the thermal-induced stress;Semiconductor Lasers and Applications XII;2022-12-27
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