A bottom-up pattern collapse mitigation strategy for EUV lithography
Author:
Affiliation:
1. Paul Scherrer Institute (Switzerland)
Publisher
SPIE
Reference20 articles.
1. www.itrs.net, visited 4 March 2016.
2. Effect of top coat and resist thickness on line-edge roughness;Singh,2006
3. Resist blur and line edge roughness;Gallatin,2005
4. Toward 10 nm half-pitch in extreme ultraviolet lithography: results on resist screening and pattern collapse mitigation techniques
5. Mechanism of Resist Pattern Collapse during Development Process
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