Author:
Schröder Henning,Kirsch Oliver,Schwietering Julian
Reference14 articles.
1. Enabling photonic system integration by applying glass based microelectronic packaging approaches;Schröder,2022
2. Photonic system integration by applying microelectronic packaging approaches using glass substrates
3. J. Schwietering, Chr. Herbst, O. Kirsch, N. Arndt-Staufenbiel, Ph. Wachholz, H. Schröder, M. Schneider-Ramelow; “Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling”; Proc. 70st ECTC, May 26–29, 2020, Orlando, USA, pp. 148–155.
4. Hybrid photonic system integration using thin glass platform technology;Schröder,2021
5. Journal of Lightwave Technology