Author:
Merget Florian,Ackermann Manuel,Shen Bin,Rodrigo Rebecca,Wang Huiyi,Wolz Michael,Witzens Jeremy
Reference16 articles.
1. Perspective on the future of silicon photonics and electronics
2. Toward higher-radix switches with co-packaged optics for improved network locality in data center and HPC networks [Invited]
3. 8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO;Hosseini,2021
4. Glass Wafer Mechanical Properties: A Comparison To Silicon;Trott,2011
5. Method and system for integrated power combiners;Mekis;US Patent US8625935B2,2011