Simulating SEM imaging of via bottoms-Reference-Cited by-同舟云学术

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Simulating SEM imaging of via bottoms

Published:2024-04-10 Issue: Volume:6518 Page:61
ISSN:
Container-title:Metrology, Inspection, and Process Control XXXVIII
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Author:

Bunday Benjamin D.,Mack Chris A.,Klotzkin Shari,Patriarche Douglas,Ball Yvette

Publisher

SPIE

Reference20 articles.

1. Simulating process subtleties in SEM imaging

2. Simulating HV-SEM imaging of HAR and buried features

3. Research Update: Electron beam-based metrology after CMOS

4. Scanning electron microscope measurement of width and shape of 10 nm patterned lines using a JMONSEL-modeled library

5. Assessing the viability of multi-electron beam wafer inspection for sub-20nm defects

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Coming of Age in Computational SEM;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

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