Comparison between e-beam direct write and immersion lithography for 20-nm node
Author:
Affiliation:
1. MAPPER Lithography, Computerlaan 15, 2628 XK Delft, The Netherlands
2. Altera Corporation, 101 Innovation Drive, San Jose, California 95134, United States
3. CEA-Leti, 17 Rue des Martyrs, 38054 GRENOBLE Cedex 9, France
Publisher
SPIE-Intl Soc Optical Eng
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Performance validation of MAPPER’s FLX-1200;Wieland,2015
2. Roadmap to sub-nanometer OPC model accuracy
3. Demonstration of electronic design automation flow for massively parallel e-beam lithography
4. Corrections to proximity effects in electron beam lithography. I. Theory
5. Projection Printing Characterization
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1. A New Simulation Method for 3-D Electron Beam Lithography;2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO);2023-07-31
2. Volatile vapor knife of immersion lithography hood using solutal Marangoni effect;Journal of Vacuum Science & Technology B;2022-09
3. Towards alternative 3D nanofabrication in macroscopic working volumes;Measurement Science and Technology;2018-10-05
4. Complete data preparation flow for Massively Parallel E-Beam lithography on 28nm node full-field design;SPIE Proceedings;2016-03-22
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