Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3671391
Reference17 articles.
1. Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding
2. SnAg Microbumps for MEMS-Based 3-D Stacks
3. A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates
4. Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps
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3. Growth behavior of tin whisker on SnAg microbump under compressive stress;Scripta Materialia;2018-04
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