Electromigration instability: Transgranular slits in interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.111750
Reference9 articles.
1. Electromigration in metals
2. Slit morphology of electromigration induced open circuit failures in fine line conductors
3. Fatal electromigration voids in narrow aluminum‐copper interconnect
4. Evolution of Electromigration-Induced Voids in Single Crystalline Aluminum Lines with Different Crystallographic Orientations
5. Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects
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2. Study of Electromigration-Induced Void Nucleation Problem Dominated by Bulk, Grain Boundary, and Interfacial Diffusion Based on an Improved Energy Approach;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10
3. Effect of conductivity on the electromigration-induced morphological evolution of islands with high symmetries of surface diffusional anisotropy;Journal of Applied Physics;2021-01-14
4. Multi-phase-field modelling of electromigration-induced void migration in interconnect lines having bamboo structures;Computational Materials Science;2020-11
5. Role of conductivity on the electromigration-induced morphological evolution of inclusions in {110}-oriented single crystal metallic thin films;Journal of Applied Physics;2019-10-28
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