Thermal stability of low dielectric constant porous silica films
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2159093
Reference10 articles.
1. Low dielectric constant materials for microelectronics
2. Low dielectric constant films prepared by plasma-enhanced chemical vapor deposition from tetramethylsilane
3. Origin of low dielectric constant of carbon-incorporated silicon oxide film deposited by plasma enhanced chemical vapor deposition
4. Porosity in low dielectric constant SiOCH films depth profiled by positron annihilation spectroscopy
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