Ni doping on Cu surfaces: Reduced copper resistivity
Author:
Affiliation:
1. Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA
Funder
National Science Foundation (NSF)
Semiconductor Research Corporation (SRC)
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4897009
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1. Resistivity dominated by surface scattering in sub-50 nm Cu wires
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