Accurate characterization of wafer bond toughness with the double cantilever specimen
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2828156
Reference16 articles.
1. Wafer direct bonding: tailoring adhesion between brittle materials
2. Silicon‐to‐silicon direct bonding method
3. Silicon Wafer Bonding Mechanism for Silicon-on-Insulator Structures
4. Bonding of silicon wafers for silicon‐on‐insulator
5. Quality and mechanical reliability assessment of wafer-bonded micromechanical components
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