First-principles calculations of the effects of Cu and Ag additions on the electromigration of Sn-based solder
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2777192
Reference24 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure
3. Electromigration in Sn–Pb solder strips as a function of alloy composition
4. Threshold current density of electromigration in eutectic SnPb solder
5. Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads
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2. Effects of alloying elements on the interfacial segregation of bismuth in tin-based solders;Materials Today Communications;2023-06
3. Effects of alloying elements on the dissolution and diffusion of Bi in Sn: A first-principles study;IOP Conference Series: Earth and Environmental Science;2021-02-01
4. Fast and Huge Anisotropic Diffusion of Cu (Ag) and Its Resistance on the Sn Self-diffusivity in Solid β–Sn;Journal of Materials Science & Technology;2016-02
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