Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Author:
Affiliation:
1. Department of Electrical Engineering and Automation, Aalto University, P.O. Box 13500, FIN-00076 Aalto, Finland
2. Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale), Germany
Funder
Lab4MEMS II
Metro43D
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
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1. Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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