Specific Heat of Some Polymers Used in Cryostat Construction (1.7 to 4 K)
Author:
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1683186
Reference10 articles.
1. Specific Heat and Thermal Boundary Resistance of LiquidHe3
2. Thermal Conductivity of Some Amorphous Dielectric Solids Below 1°K
3. Magnetic Susceptibility of Materials Commonly Used in the Construction of Cryogenic Apparatus
4. Epoxy Resin Seals to Copper and Nylon for Cryogenic Applications
5. Epoxy Resin as a Material for Constructing Cryogenic Apparatus
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