Influence of substrate-induced thermal stress on the superconducting properties of V 3 Si thin films-Reference-Cited by-同舟云学术

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Influence of substrate-induced thermal stress on the superconducting properties of V 3 Si thin films

Published:2021-03-14 Issue:10 Volume:129 Page:105104
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Vethaak T. D.¹²^ORCID,Gustavo F.¹,Farjot T.²,Kubart T.³^ORCID,Gergaud P.²,Zhang S.-L.³^ORCID,Nemouchi F.²^ORCID,Lefloch F.¹

Affiliation:

1. Université Grenoble Alpes, CEA, Grenoble INP, IRIG, PHELIQS, 38000 Grenoble, France

2. Université Grenoble Alpes, CEA LETI, 38000 Grenoble, France

3. Division of Solid-State Electronics, Department of Electrical Engineering, Uppsala University, 75103 Uppsala, Sweden

Funder

Agence Nationale de la Recherche

H2020 European Research Council

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0038638

Reference43 articles.

1. Schottky barrier height modulation by atomic dipoles at the silicide/silicon interface

2. Towards implementation of a nickel silicide process for CMOS technologies

3. Metal Silicides in CMOS Technology: Past, Present, and Future Trends

4. The chips are down for Moore’s law

5. The Economic Limit to Moore's Law

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3. Revolution of next-generation interconnect materials and key processes for advanced chips in post-moore era;SCIENTIA SINICA Chimica;2023-08-17

4. Investigations at low temperature of 90 nm pitch BEOL for quantum applications;2022 IEEE International Interconnect Technology Conference (IITC);2022-06-27

5. Superconducting V3Si for quantum circuit applications;Microelectronic Engineering;2021-05

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