Shallow junction cobalt silicide contacts with enhanced electromigration resistance
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.332940
Reference6 articles.
1. Aluminum‐silicide reactions. I. Diffusion, compound formation, and microstructure
2. Aluminum contact to nickel silicide using a thin tungsten barrier
3. Interfacial reactions between aluminum and transition‐metal nitride and carbide films
4. TiN as a diffusion barrier between CoSi2 or PtSi and aluminum
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