Mask undercut in deep silicon etch
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3579542
Reference17 articles.
1. Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems
2. High aspect ratio silicon etch: A review
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5. Advanced time-multiplexed plasma etching of high aspect ratio silicon structures
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