Temperature and field dependencies of current leakage mechanisms in IrOx contacts on InAlN/GaN heterostructures
Author:
Affiliation:
1. Department of Electrical Engineering, Stanford University 1 , Stanford, California 94305, USA
2. Department of Aeronautics and Astronautics, Stanford University 2 , Stanford, California 94305, USA
Abstract
Funder
National Aeronautics and Space Administration
National Science Foundation
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
https://pubs.aip.org/aip/apl/article-pdf/doi/10.1063/5.0171204/18161187/152101_1_5.0171204.pdf
Reference26 articles.
1. InAlN/GaN HEMTs for operation in the 1000 °C Regime: A first experiment;IEEE Electron Device Lett.,2012
2. Ultrathin body InAlN/GaN HEMTs for high-temperature (600 °C) electronics;IEEE Electron Device Lett.,2013
3. Electrical degradation of InAlN/GaN HEMTs operating under on conditions;IEEE Trans. Electron Devices,2016
4. Gate leakage mechanisms in AlGaN/GaN and AlInN/GaN HEMTs: Comparison and modeling;IEEE Trans. Electron Devices,2013
5. Polarization effects on gate leakage in InAlN/AlN/GaN high-electron-mobility transistors;Appl. Phys. Lett.,2012
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