Low-k material damage during photoresist ashing process
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4919081
Reference34 articles.
1. Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma
2. H. Shi , H. Huang , J. Im , and P. S. Ho , Proceedings of the IEEE International Interconnect Technology Conference (IITC) 2010, pp. 1–3.
3. Enhancing the Oxygen Plasma Resistance of Low-kMethylsilsesquioxane by H2Plasma Treatment
4. Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
5. H. Shi , Ph.D. dissertation, The University of Texas at Austin, 2010.
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