Void formation in Nb3Sn‐Cu superconducting wire produced by the external tin process
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.336399
Reference15 articles.
1. Analysis of the tin diffusion step in Nb3Sn‐Cu superconducting wire produced by the external tin process
2. Fabrication of large diameter external-diffusion processed Nb<inf>3</inf>Sn composites
3. Interdiffusion in CuSn solid solutions. confirmation of anomalously large kirkendall effect
4. Interdiffusion and Kirkendall Effect in Cu–Sn Alloys
5. Motion of Inclusion Induced by a Direct Current and a Temperature Gradient
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. On the formation of voids in internal tin Nb3Sn superconductors;Applied Physics Letters;2007-03-26
2. Synchrotron Tomography for the Study of Void Formation in Internal Tin ${\hbox {Nb}}_{3}{\hbox {Sn}}$ Superconductors;IEEE Transactions on Applied Superconductivity;2007-03
3. Kinetic neutron diffraction study of Nb3Sn phase formation in superconducting wires;Journal of Physics: Condensed Matter;2006-01-13
4. Kinetics of phase growth in the Cu-Sn system and application to composite Nb/sub 3/Sn strands;IEEE Transactions on Appiled Superconductivity;2003-06
5. The influence of the starting Cu-Sn phase on the superconducting properties of subsequently reacted internal-Sn Nb/sub 3/Sn conductors;IEEE Transactions on Appiled Superconductivity;2001-03
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