Adhesive tapes: From daily necessities to flexible smart electronics

Author:

He Xuecheng12ORCID,Wang Wenyu3ORCID,Yang Shijie2ORCID,Zhang Feilong4ORCID,Gu Zhen2,Dai Bing1,Xu Tailin1ORCID,Huang Yan Yan Shery3ORCID,Zhang Xueji1

Affiliation:

1. School of Biomedical Engineering, Health Science Center, Shenzhen University 1 , Shenzhen 518060, China

2. Beijing Advanced Innovation Center for Materials Genome Engineering, Research Center for Bioengineering and Sensing Technology, University of Science and Technology Beijing 2 , Beijing 100083, China

3. Department of Engineering, University of Cambridge 3 , Cambridge CB2 1PZ, United Kingdom

4. Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University 4 , Singapore 639798, Singapore

Abstract

Imprinting “sticky” features on the surfaces of common non-sticky flexible materials, such as paper, textile, and polymeric films produces a myriad of adhesive tapes that we use in our daily lives. Recently, the rise of flexible electronics has harnessed the distinct adhesive behavior of adhesive tapes to achieve special scientific and engineering purposes. In this review, recent advances including the structures, properties, mechanisms, and functionalities of adhesive tapes and relevant flexible smart electronics are summarized. We provide a key focus on how the distinct adhesive behavior of adhesive tapes contributes to the redesign and engineering of flexible electronics via physical and/or chemical modifications. The applications of these flexible smart electronics enabled by adhesive tapes are widespread, including high-performance sensors, energy storage/conversion devices, medical and healthcare patches, etc. Finally, we discuss unmet needs and current challenges in the development of adhesive tape-enabled materials and techniques for flexible electronics. With ongoing material and technical innovations, adhesive tape-related electronic products are expected to revolutionize our lifestyle and lead us into the era of artificial intelligence.

Funder

Joint Fund of the Ministry of Education for Equipment Pre-research

Shenzhen Stability Support Plan

Shenzhen Overseas Talent Program, and Shenzhen Key Laboratory for Nano-Biosensing

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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