Effect of microstructure on diffusion of copper in TiN films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1566472
Reference16 articles.
1. Interactions of Cu with CoSi2, CrSi2and TiSi2with and without TiNxbarrier layers
2. Multilevel interconnections for ULSI and GSI era
3. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
4. The use of in situ X-ray diffraction, optical scattering and resistance analysis techniques for evaluation of copper diffusion barriers in blanket films and damascene structures
5. Effects of the underlayer substrates on copper chemical vapor deposition
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