Interface/border trap characterization of Al2O3/AlN/GaN metal-oxide-semiconductor structures with an AlN interfacial layer

Author:

Liu Shenghou1ORCID,Yang Shu1,Tang Zhikai1ORCID,Jiang Qimeng1,Liu Cheng1ORCID,Wang Maojun2,Shen Bo3,Chen Kevin J.1

Affiliation:

1. Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

2. Institute of Microelectronics, Peking University, Beijing 100871, China

3. School of Physics, Peking University, Beijing 100871, China

Funder

NSFC/RGC joint research project

Innovation and Technology Commmission (ITF)

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Reference23 articles.

1. W. Huang , Z. Li , T. P. Chow , Y. Niiyama , and S. Yoshida , in Proceedings of the 20th International Symposium on Power Semiconductor Devices and ICs ( IEEE, 2008), pp. 295–298.

2. Effects of TMAH Treatment on Device Performance of Normally Off $\hbox{Al}_{2}\hbox{O}_{3}/\hbox{GaN}$ MOSFET

3. Characterization of traps and trap-related effects in recessed-gate normally-off AlGaN/GaN-based MOSHEMT

4. High-Performance Normally-Off ${\rm Al}_{2}{\rm O}_{3}/{\rm GaN}$ MOSFET Using a Wet Etching-Based Gate Recess Technique

5. S. Ozaki , T. Ohki , M. Kanamura , T. Imada , N. Nakamura , N. Okamoto , T. Miyajima , and T. Kikkawa , in Proceedings of CS MANTECH Conference (2012), pp. 1–4, available at http://gaasmantech.com/Digests/2012/papers/11a.1.087.pdf.

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