Interdiffusion, hardness and resistivity of Cr/Cu/Co/Au thin films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.349565
Reference6 articles.
1. Interdiffusion and resistivity of Cu/Au, Cu/Co, Co/Au, and Cu/Co/Au thin films at 25–550 °C
2. X‐ray study of interdiffusion in bimetallic Cu–Au films
3. Vacancies in Cu3Au and CuAu by Positron Annihilation
4. Diffusion of Gold in Copper over a Wide Range of Temperature
5. Diffusion Measurements in the System Cu-Au by Elastic Scattering
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1. High-throughput investigation of structural evolution upon solid-state in Cu–Cr–Co combinatorial multilayer thin-film;Materials & Design;2022-03
2. Long-range chemical interactions in solid-state reactions: effect of an inert Ag interlayer on the formation of L10-FePd in epitaxial Pd(0 0 1)/Ag(0 0 1)/Fe(0 0 1) and Fe(0 0 1)/Ag(0 0 1)/Pd(0 0 1) trilayers;Philosophical Magazine;2014-06-11
3. Interdiffusion in nanometer-scale multilayers investigated byin situlow-angle x-ray diffraction;Physical Review B;1999-04-15
4. Resistance behaviour and interdiffusion of layered CuNi-NiCr films;Thin Solid Films;1995-03
5. Electrochemically Deposited Diffusion Barriers;Journal of The Electrochemical Society;1994-07-01
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