The impact of film thickness and substrate surface roughness on the thermal resistance of aluminum nitride nucleation layers
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4808238
Reference24 articles.
1. Benchmarking of Thermal Boundary Resistance in AlGaN/GaN HEMTs on SiC Substrates: Implications of the Nucleation Layer Microstructure
2. Reducing Thermal Resistance of AlGaN/GaN Electronic Devices Using Novel Nucleation Layers
3. Temperature dependence of thermal conductivity of AlxGa1−xN thin films measured by the differential 3ω technique
4. The intrinsic thermal conductivity of AIN
5. Heat-Transport Mechanisms in Superlattices
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