Flexible terahertz spoof plasmonics based on graphene-assembled films

Author:

Zhang Bohan12ORCID,He Dapeng2ORCID,Zhang Qian2,Fang Jiaxing2,Lu Xueguang3,Huang Wanxia3,Chen Zibo4,He Daping4ORCID,Kang Lei5ORCID,Werner Douglas H.5ORCID,Wang Shengxiang12ORCID

Affiliation:

1. State Key Laboratory of New Textile Materials and Advanced Processing Technologies, Wuhan Textile University 1 , Wuhan 430200, People's Republic of China

2. School of Mathematical and Physical Sciences, Wuhan Textile University 2 , Wuhan 430200, People's Republic of China

3. College of Materials Science and Engineering, Sichuan University 3 , Chengdu 610065, Sichuan, China

4. Hubei Engineering Research Center of RF-Microwave Technology and Application, Wuhan University of Technology 4 , Wuhan 430070, People's Republic of China

5. Department of Electrical Engineering and Center for Nanoscale Science, The Pennsylvania State University 5 , University Park, Pennsylvania 16802, USA

Abstract

Spoof plasmonics, which can enable strong terahertz (THz) radiation–matter interactions, hold great promise for the advancement of THz science and technology. However, THz spoof plasmonic devices based on micro-structured metals are in general limited by lithography-based fabrication processes as well as metals' mechanical, chemical, and thermal stability, which hinders their applications in, for instance, flexible and wearable THz imaging and communications, molecular sensing, etc. Possessing high electrical conductivity and outstanding mechanical robustness, graphene-assembled films (GAFs) promise many benefits for electronics as an alternative to metals. Here, by studying the resonance-enhanced transmission properties of subwavelength GAF hole arrays, we demonstrate a GAF metasurface as a transformative platform for flexible THz spoof plasmonics. Based on a laser direct writing (LDW) patterning technique, the proposed micro-engineered GAF is expected to pave the way toward large-area, durable, and inexpensive THz metadevices with superior flexibility.

Publisher

AIP Publishing

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