Mechanical property changes in porous low-k dielectric thin films during processing
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4898351
Reference28 articles.
1. Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies
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