Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2790376
Reference12 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Thermomigration in SnPb composite flip chip solder joints
3. Proceeding of Electronic Components and Technology Conference, IEEE Components, Packaging, and Manufacturing Technology Society;Wright S. L.,2006
4. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
5. Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
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