Uniform deposition method of monodispersed SiO2 nanoparticles on a 300-mm Si wafer surface-Reference-Cited by-同舟云学术

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Uniform deposition method of monodispersed SiO2 nanoparticles on a 300-mm Si wafer surface

Published:2021-11-01 Issue:11 Volume:92 Page:113704
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Lee Seungjae¹,Choi Seulgi¹,Cho Yujin¹,Oh Haerim²,Chae Seung-Ki³,Kim Taesung¹⁴^ORCID

Affiliation:

1. School of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, South Korea

2. R and D Center, SEMES Co., Ltd., Hwaseong 18383, South Korea

3. Research and Business Foundation, Sungkyunkwan University, Suwon 16419, South Korea

4. SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Suwon 16419, South Korea

Funder

Korea Institute for Advancement of Technology

National Research Foundation of Korea

Publisher

AIP Publishing

Subject

Instrumentation

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0067262

Reference24 articles.

1. Adhesion and Removal of Fine Particles on Surfaces

2. The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies

3. Standard Sample Preparation for the Analysis of Several Metals on Silicon Wafer.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 10nm Particle Deposition Capability for Qualification of Next-Generation Defect Inspection Tools;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

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