Characterization of subsurface damage in GaAs processed by Ga+focused ion‐beam‐assisted Cl2etching using photoluminescence
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.344439
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1. A negative tone lift-off method for small metal holes using PMMA/SiO2 double layer;Bulletin of Materials Science;2021-10-31
2. Iodine enhanced focused-ion-beam etching of silicon for photonic applications;Journal of Applied Physics;2007-11-15
3. Reactive ion etching induced damage evaluation for optoelectronic device fabrication;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006
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5. Surface Damage Induced by Dry Etching;Handbook of Advanced Plasma Processing Techniques;2000
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