Influence of electric artwork on thermomechanical properties and warpage of printed circuit boards
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1580645
Reference9 articles.
1. Using waviness to reduce thermal warpage in printed circuit boards
2. Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers
3. Evolution of stresses in passivated and unpassivated metal interconnects
4. Thermoelastic properties in combined bending and extension of thin composite laminates with transverse matrix cracks
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2. Bending analysis of glass fiber reinforced epoxy composites/copper-clad laminates for multi-layer printed circuit boards;Hybrid Advances;2023-12
3. Optimal Dummy Pattern Design Method for PWB Warpage Control Using the Human-Based Genetic Algorithm;Micromachines;2020-08-25
4. Simulation of Warpage During Fabrication of Printed Circuit Boards;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-06
5. Micromechanical analysis of copper trace in printed circuit boards;Microelectronics Reliability;2011-02
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