Aligned carbon nanotubes for through-wafer interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2759989
Reference20 articles.
1. Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating
2. In situ transmission electron microscopy observations of 1.8μm and 180nm Cu interconnects under thermal stresses
3. Finite‐element modeling of stress distribution and migration in interconnecting studs of a three‐dimensional multilevel device structure
4. Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating
Cited by 54 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint;Microelectronic Engineering;2024-07
2. An Introduction to Nanomaterials for Nanopackaging;IEEE Nanotechnology Magazine;2024-04
3. Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects;Micromachines;2022-07-20
4. Impact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System;ECS Journal of Solid State Science and Technology;2021-11-01
5. Tailoring the surface morphology of carbon nanotube forests by plasma etching: A parametric study;Carbon;2021-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3