Effect of bismuth on wettability of Sn-2.5Ag-0.5Cu-0.5Bi quaternary solder alloy on Cu substrate
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http://aip.scitation.org/doi/pdf/10.1063/1.5078880
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2. A review of lead-free solders for electronics applications
3. Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology
4. Development of SnAg-based lead free solders in electronics packaging
5. Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A new approach for measuring the wetting angles of lead-free solder alloys from digital images;Engineering Science and Technology, an International Journal;2022-12
2. Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate;International Journal of Modern Physics C;2020-07-20
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