The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2963473
Reference11 articles.
1. Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
2. Local melting induced by electromigration in flip-chip solder joints
3. Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
4. Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints
5. Issues in accelerated electromigration of solder bumps
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2. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints;Materials Characterization;2020-05
3. Growth and evolution kinetics of intermetallic compounds in Sn-0.7Cu-10Bi-0.15Co/Cu interface;Materials Research Express;2019-08-02
4. Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation;Materials Science and Engineering: A;2019-07
5. Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current;Journal of Materials Science: Materials in Electronics;2017-12-27
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