Thermal boundary conductance across Co/Cu interfaces with spin–lattice interactions
Author:
Affiliation:
1. Mechanical and Aerospace Engineering Department, University of California, Los Angeles, California 90095, USA
2. Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, People’s Republic of China
Funder
National Science Foundation
UCLA Institute for Digital Research and Education
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0069358
Reference17 articles.
1. Spin Seebeck insulator
2. Transmission of electrical signals by spin-wave interconversion in a magnetic insulator
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5. Atomistic simulation of phonon and magnon thermal transport across the ferromagnetic-paramagnetic transition
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