Study on the electrical performance degradation mechanism of β -Ga2O3 p-n diode under heavy ion radiation

Author:

Yue Shaozhong1ORCID,Zheng Xuefeng1ORCID,Zhang Fang1ORCID,Lin Danmei1ORCID,Bu Sijie1,Wang Yingzhe1,Hu Peipei2ORCID,Liu Jie2ORCID,Zhang Weidong3ORCID,Zhang Jianfu3ORCID,Ma Xiaohua1,Hao Yue1ORCID

Affiliation:

1. State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Faculty of Integrated Circuits, Xidian University 1 , Xi'an 710071, People's Republic of China

2. Institute of Modern Physics, Chinese Academy of Sciences (CAS) 2 , Lanzhou 730000, China

3. The School of Engineering, Liverpool John Moores University 3 , Liverpool L3 3AF, United Kingdom

Abstract

The impact of heavy ion irradiation on the β-Ga2O3 p-n diode and its physical mechanism have been studied in this Letter. After the irradiation fluence of 1 × 108 cm−2, it is observed that the electrical performance of the device is significantly degraded. The forward current density (JF) is reduced by 49.4%, the reverse current density (JR) is increased by more than two orders of magnitude, and the breakdown voltage (VBR) is decreased by 30%. Based on the results of the deep-level transient spectroscopy measurement, it is concluded that acceptor-like traps generated with an energy level of EC-0.75 eV in the β-Ga2O3 drift layer dominate the JF degradation of the device, which are most likely related to Ga vacancies. These acceptor-like traps result in the reduction of change carrier concentration, which in turn leads to a decrease in JF. In addition, according to the conductive atomic force microscope measurements and theoretical calculation, it is clearly observed that the latent tracks induced by heavy ion irradiation can act as leakage paths, leading to a significant degradation of JR and VBR.

Funder

National Natural Science Foundation of China

the Fund of National Innovation Center of Radiation Application

the National Key R&D Program of China

Publisher

AIP Publishing

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