Reactive solid-state dewetting of Cu–Ni films on silicon-Reference-Cited by-同舟云学术

Reactive solid-state dewetting of Cu–Ni films on silicon

Published:2010-12-20 Issue:25 Volume:97 Page:253101
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Clearfield Raphael,Railsback Justin G.,Pearce Ryan C.,Hensley Dale K.,Fowlkes Jason D.,Fuentes-Cabrera Miguel,Simpson Michael L.,Rack Philip D.,Melechko Anatoli V.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3527078

Reference15 articles.

1. Spinodal Dewetting in Liquid Crystal and Liquid Metal Films

2. Dewetting of thin polymer films

3. Thermocapillary effects in driven dewetting and self assembly of pulsed-laser-irradiated metallic films

4. Solid-state dewetting of patterned thin films

5. Pulsed laser dewetting of patterned thin metal films: A means of directed assembly

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