Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications-Reference-Cited by-同舟云学术

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Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications

Published:2015-08-31 Issue:9 Volume:107 Page:093105
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Su Ya-Wen¹,Wu Cen-Shawn²,Liu Chih-Hua²,Lin Hung-Yi³,Chen Chii-Dong⁴

Affiliation:

1. National Nano Device Laboratories, National Applied Research Laboratories, Hsinchu 300, Taiwan

2. Department of Physics, National Changhua University of Education, Changhua 500, Taiwan

3. Department of Material Science, National University of Tainan, Tainan 700, Taiwan

4. Institute of Physics, Academia Sinica, Taipei 115, Taiwan

Funder

Ministry of Science and Technology, Taiwan (MOST)

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4930154

Reference21 articles.

1. Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

2. Dependence of copper interconnect electromigration phenomenon on barrier metal materials

3. In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

4. Scalable Graphite/Copper Bishell Composite for High-Performance Interconnects

5. Transport in Nanoribbon Interconnects Obtained from Graphene Grown by Chemical Vapor Deposition

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Unleashing the Performance of Self‐Rolled‐Up 3D Inductors via Deterministic Electroplating on Cylindrical Surfaces;Advanced Materials Technologies;2024-03-18

2. Remarkable Effects of an Electrodeposited Copper Skin on the Strength and the Electrical and Thermal Conductivities of Reduced Graphene Oxide-Printed Scaffolds;ACS Applied Materials & Interfaces;2020-05-05

3. Optical Relaxation Time Enhancement in Graphene-Passivated Metal Films;Scientific Reports;2016-07-27

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