Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications-Reference-Cited by-同舟云学术

Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications

Published:2008-07-15 Issue:2 Volume:104 Page:023522
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Ogurtani Tarik Omer,Akyildiz Oncu

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2958303

Reference44 articles.

1. Motions of Microscopic Surfaces in Materials

2. Stress analysis of encapsulated fine‐line aluminum interconnect

3. Stress in metal lines under passivation; comparison of experiment with finite element calculations

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