An ultrathin Zr(Ge) alloy film as an exhaustion interlayer combined with Cu(Zr) seed layer for the Cu/porous SiOC:H dielectric integration
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3013565
Reference17 articles.
1. Preparation and structure of porous dielectrics by plasma enhanced chemical vapor deposition
2. Growth behavior of self-formed barrier at Cu–Mn∕SiO2 interface at 250–450°C
3. Self-forming diffusion barrier layer in Cu–Mn alloy metallization
4. Low leakage current Cu(Ti)/SiO2 interconnection scheme with a self-formed TiOx diffusion barrier
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