Atomic-resolved structural and electric field analysis of the passivation interface of MIS-HEMTs

Author:

Zhang Jiahui12ORCID,Su Xujun1ORCID,Cai Yutao3,Li Didi12,Wang Luhua1,Chen Jingjing1,Zeng Xionghui1ORCID,Wang Jianfeng1,Xu Ke124

Affiliation:

1. Suzhou Institute of Nano-Tech and Nano-Bionics, CAS, Ruoshui Road 398, Suzhou Industrial Park, Suzhou 215123, China

2. School of Physical Science and Technology, ShanghaiTech University, Middle Huaxia Road 393, Pudong, Shanghai 201210, China

3. Department of Electrical and Electronic Engineering, Xi’an Jiaotong-Liverpool University, Suzhou 215123, China

4. Shenyang National Laboratory for Materials Science, Jiangsu Institute of Advanced Semiconductors, Jinji Lake Avenue 99, Suzhou Industrial Park, Suzhou 215000, China

Abstract

The passivation interfaces of GaN-based MIS-HEMTs with Si3N4 and ZrO2/Si3N4 bilayers were investigated through atomic resolution scanning transmission electron microscope–energy dispersive spectroscopy–differential phase contrast microscopy methods. It is found that the Si3N4/GaN interface exhibits atomic disorder fluctuation, and the GaN surface is discontinuous at the depth of 1–2 atomic layers. An oxide layer of ∼2 nm is formed at the ZrO2/GaN interface, and the GaN surface is atomically flat. Furthermore, the local minimum of the potential is located at the Si3N4/GaN interface, while it is distributed in the GaN side at the ZrO2/GaN interface. The electric field or potential distribution is affected by the crystal orientation of the polycrystalline ZrO2 layer. Finally, the difference in passivation mechanism is discussed.

Funder

The National Natural Science Foundation of China

The National Key R&D Program of China

2020 Key R&D Program-Industry Foresight and Key Core Technologies of Jiangsu Province

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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