Mechanism for improvement of n-channel metal-oxide-semiconductor transistors by tensile stress

Author:

Yang Peizhen,Lau W. S.,Lai Seow Wei,Lo V. L.,Toh L. F.,Wang Jacob,Siah S. Y.,Chan L.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Experimental Evaluation of Parasitic Bipolar Effects and Mechanical Stress Effects in SOI-Power-MOSFETs;Journal of The Japan Institute of Electronics Packaging;2022-01-01

2. A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors;2019 IEEE International Test Conference in Asia (ITC-Asia);2019-09

3. Diffusive Electron-phonon Interaction for Terahertz Radiation;2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring);2019-06

4. The role of a tensile stress bias for a sensitive silicon mechanical stress sensor based on a change in gate-induced-drain leakage current;Microelectronics Reliability;2012-11

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