Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2212533
Reference22 articles.
1. Chemical interactions at Ta/fluorinated polymer buried interfaces
2. SILK compatibility with the IMD process using copper metallization
3. In situ x-ray photoelectron spectroscopy measurement during Ta deposition on low-k dielectric SiLK™
4. Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material
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