Affiliation:
1. Shanghai Jiao Tong University Department of Electronic Engineering, State Key Lab of Advanced Optical Communication Systems and Networks, , Shanghai 200240, China
Abstract
In this chapter, we brainstorm future perspectives on passive silicon-family photonic devices for long term applications, including operation wavelength, integration density, and volume production. In particular, we investigate suitable materials and waveguides with low losses for the ultraviolet, visible, infrared, and mid-infrared bands, respectively. We also analyze the limitations on the integration density of different waveguides. Furthermore, we investigate mass production that involves the volume and yield issue of the photonic devices. Finally, we discuss the future picture of heterogeneous photonic integration with diverse materials on a monolithic chip.
Publisher
AIP Publishing LLCMelville, New York