Integrated experimental and computational approach for residual stress investigation near through-silicon vias-Reference-Cited by-同舟云学术

Integrated experimental and computational approach for residual stress investigation near through-silicon vias

Author:

Deluca Marco¹²,Hammer René¹,Keckes Jozef³,Kraft Jochen⁴,Schrank Franz⁴,Todt Juraj³,Robach Odile⁵,Micha Jean-Sébastien⁵,Defregger Stefan¹

Affiliation:

1. Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria

2. Institut für Struktur- und Funktionskeramik, Montanuniversitaet Leoben, Peter Tunner Straße 5, 8700 Leoben, Austria

3. Department of Materials Physics, Montanuniversitaet Leoben, Franz Josef Straße 18, 8700 Leoben, Austria

4. ams AG, Tobelbader Strasse 30, 8141 Premstätten, Austria

5. Univ. Grenoble Alpes and CEA/INAC/MEM & UMR CNRS SPrAM, 17 rue des Martyrs, Grenoble, France

Funder

Österreichische Forschungsförderungsgesellschaft (FFG)

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

Reference30 articles.

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