Hydrogen plasma effects on ultralow-k porous SiCOH dielectrics
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2060935
Reference12 articles.
1. Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition
2. Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-kto extreme low-kinterconnect materials
3. Preventing dielectric damage of low-k organic siloxane by passivation treatment
4. Characterization and integration of a CVD porous SiOCH (k<2.5) with enhanced mechanical properties for 65 nm CMOS interconnects and below
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