Nucleation and growth of tin whiskers-Reference-Cited by-同舟云学术

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Nucleation and growth of tin whiskers

Published:2011-06-13 Issue:24 Volume:98 Page:241910
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Cheng Jing,Vianco Paul T.,Zhang Bei,Li James C. M.

Funder

National Nuclear Security Administration, U.S. Department of Energy

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3597653

Reference24 articles.

1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

2. Annotated tin whisker bibliography and anthology

3. Sn-whiskers: truths and myths

4. Accelerated growth of tin whiskers

5. Proceedings of the Electronic Components and Technology Conference;Dittes M.,2003

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1. Corrosion behaviors of Co, Co/Pd, and Co/Pd/Au surface finishes;Journal of the Taiwan Institute of Chemical Engineers;2022-09

2. Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint;Materials;2021-02-05

3. A note on the effect of surface energy on the growth of a tin whisker;Philosophical Magazine Letters;2020-08-17

4. Kinetics of Sn whisker growth from Sn thin-films on Cu substrate;Journal of Materials Science: Materials in Electronics;2020-08-17

5. Modeling analysis for the growth of a Li sphere and Li whisker in a solid-state lithium metal battery;Physical Chemistry Chemical Physics;2020

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