Electromigration kinetics and critical current of Pb-free interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4870833
Reference19 articles.
1. Physics and materials challenges for lead-free solders
2. Effect of contact metallization on electromigration reliability of Pb-free solder joints
3. B. Ebersberger and C. Lee, in Proceedings of the 58th Electronic Components and Technology Conference (IEEE, 2008), p. 59.
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2. Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects;Journal of Materials Science: Materials in Electronics;2017-05-18
3. Effect of Joule heating and current crowding on electromigration in mobile technology;Applied Physics Reviews;2017-03
4. Joule Heating Enhanced Electromigration Failure in Redistribution Layer in 2.5D IC;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05
5. Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits;Journal of Applied Physics;2015-10-07
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