Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1555274
Reference17 articles.
1. Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
2. Lateral Transport through Self-Assembled InAs Quantum Dots Located in the Narrow Gap Electrodes
3. Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. II. X-ray investigation of primary recrystallization
4. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature
5. Seed layer dependence of room-temperature recrystallization in electroplated copper films
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